Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412630 | Securing mechanism and method for wafer bonder | David J. Zapp | 2016-08-09 |
| 9296194 | Debonders and related devices and methods for semiconductor fabrication | David J. Zapp, Daniel Eduardo Sanchez, Hung V. Phan, Hyong-yong Lee | 2016-03-29 |