Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9231124 | Ball grid array packaged camera device soldered to a substrate | Binghua Pan, Yew Kwang Low | 2016-01-05 |
SY
Sim Ying Yong
Overall (2016): #224,978 of 481,213Top 50%
1
Patents 2016