Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520387 | Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer | Yong Hoon Kim, Hee-Seok Lee, Seong-Ho Shin, Yun-Hee Lee | 2016-12-13 |