Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9364914 | Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball | Jaegwon Jang, Chul-Yong Jang | 2016-06-14 |
| 9343437 | Semiconductor package devices | Ae-Nee Jang, Jin-Woo Park, Jongho Lee | 2016-05-17 |