Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466580 | Semiconductor package and manufacturing method thereof | Jong Sik Paek | 2016-10-11 |
| 9431447 | Package of finger print sensor and fabricating method thereof | Jin Young Kim, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim +1 more | 2016-08-30 |
| 9406639 | Semiconductor package and manufacturing method thereof | Jin Young Kim, Yoon Joo Kim, Choon Heung Lee, Jin Han Kim, Seung Jae Lee +3 more | 2016-08-02 |
| 9293403 | Semiconductor package with improved redistribution layer design and fabricating method thereof | Ji Yeon Ryu, Go Woon Jung | 2016-03-22 |