Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373574 | Semiconductor packages and methods of forming the same | Ae-Nee Jang, Young Lyong Kim | 2016-06-21 |
| 9364914 | Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball | Seokhyun Lee, Chul-Yong Jang | 2016-06-14 |