Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9519105 | Self-assembled vertically aligned multi-chip module | Xuezhe Zheng, Jin Hyoung Lee, Kannan Raj, Ashok V. Krishnamoorthy | 2016-12-13 |
| 9488777 | Back-side etching and cleaving of substrates | Jin Hyoung Lee, Xuezhe Zheng, Ashok V. Krishnamoorthy | 2016-11-08 |
| 9470855 | Self-assembled vertically aligned multi-chip module | Xuezhe Zheng, Jin Hyoung Lee, Kannan Raj, Ashok V. Krishnamoorthy | 2016-10-18 |
| 9465169 | Single shot correction of resonant optical components | Stevan S. Djordjevic, Shiyun Lin, Xuezhe Zheng, John E. Cunningham, Ashok V. Krishnamoorthy | 2016-10-11 |
| 9411177 | Integrated electro-absorption modulator | John E. Cunningham, Jin Yao, Guoliang Li, Xuezhe Zheng, Shiyun Lin +3 more | 2016-08-09 |
| 9297971 | Hybrid-integrated photonic chip package with an interposer | Hiren D. Thacker, Ashok V. Krishnamoorthy, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng +2 more | 2016-03-29 |
| 9281268 | Method for fabricating multi-chip module with multi-level interposer | Eugene M. Chow, John E. Cunningham, James G. Mitchell | 2016-03-08 |
| 9250403 | Hybrid-integrated photonic chip package with an interposer | Hiren D. Thacker, Frankie Y. Liu, Robert D. Hopkins, Jon Lexau, Xuezhe Zheng +4 more | 2016-02-02 |