| 9501603 |
Integrated circuit design changes using through-silicon vias |
Joachim Keinert, Sridhar H. Rangarajan, Haoxing Ren, Sourav Saha |
2016-11-22 |
| 9437285 |
Write address synchronization in 2 read/1write SRAM arrays |
Silke Penth, Wolfgang Penth, Tobias Werner |
2016-09-06 |
| 9412682 |
Through-silicon via access device for integrated circuits |
Joachim Keinert, Sridhar H. Rangarajan, Haoxing Ren, Sourav Saha |
2016-08-09 |
| 9406375 |
Write address synchronization in 2 read/1write SRAM arrays |
Silke Penth, Wolfgang Penth, Tobias Werner |
2016-08-02 |
| 9395996 |
Pipelining out-of-order instructions |
Tim Niggemeier |
2016-07-19 |
| 9337122 |
Transferring heat through an optical layer of integrated circuitry |
Thomas J. Brunschwiler, Roger F. Dangel, Hubert Harrer, Andreas Huber, Norbert M. Meier +5 more |
2016-05-10 |
| 9268738 |
Three-dimensional permute unit for a single-instruction multiple-data processor |
Tim Niggemeier |
2016-02-23 |
