Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466588 | Method and apparatus for multi-chip structure semiconductor package | Audel A. Sanchez, Lakshminarayan Viswanathan | 2016-10-11 |
| 9450547 | Semiconductor package having an isolation wall to reduce electromagnetic coupling | Margaret A. Szymanowski, Sarmad K. Musa, Mahesh K. Shah | 2016-09-20 |
| 9337774 | Packaged RF amplifier devices and methods of manufacture thereof | Margaret A. Szymanowski, L. M. Mahalingam, Sarmad K. Musa, Jerry L. White | 2016-05-10 |
| 9300254 | Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof | Mahesh K. Shah, Jerry L. White, Li Li, Hussain H. Ladhani, Audel A. Sanchez +1 more | 2016-03-29 |
| 9263375 | System, method and apparatus for leadless surface mounted semiconductor package | Lakshminarayan Viswanathan, Lakshmi N. Ramanathan, Audel A. Sanchez | 2016-02-16 |
| 9236363 | Wedge bond foot jumper connections | Jeffrey K. Jones, Basim Noori, Mohd Salimin Sahludin | 2016-01-12 |