Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9329227 | Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit board | Min-Jae Woo | 2016-05-03 |
| 9283698 | System and method for preventing warpage of metal components during manufacturing processes | Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin | 2016-03-15 |