Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9263414 | Flip chip packaging method, and flux head manufacturing method applied to the same | Kyeong-Min Yeo, Seung-min Ryu, Ji Ho Uh, Suk Won Lee | 2016-02-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9263414 | Flip chip packaging method, and flux head manufacturing method applied to the same | Kyeong-Min Yeo, Seung-min Ryu, Ji Ho Uh, Suk Won Lee | 2016-02-16 |