Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496198 | Integration of backside heat spreader for thermal management | Archana Venugopal, Marie Denison, Luigi Colombo, Hiep Xuan Nguyen | 2016-11-15 |
| 9373572 | Semiconductor package having etched foil capacitor integrated into leadframe | Gregory E. Howard, Bernardo Gallegos, Rajiv Dunne, Siva Prakash Gurrum, Manu J. Prakuzhy +1 more | 2016-06-21 |