Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349711 | Semiconductor device with face-to-face chips on interposer and method of manufacturing the same | Chia-Chung Wang | 2016-05-24 |
| 9318411 | Semiconductor package with package-on-package stacking capability and method of manufacturing the same | Chia-Chung Wang | 2016-04-19 |
| 9299651 | Semiconductor assembly and method of manufacturing the same | Chia-Chung Wang | 2016-03-29 |
| 9230901 | Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same | Chia-Chung Wang | 2016-01-05 |