Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9364914 | Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball | Seokhyun Lee, Jaegwon Jang | 2016-06-14 |
| 9281235 | Semiconductor packages and methods of forming the same | Young Lyong Kim, Taehoon Kim, Jongho Lee | 2016-03-08 |
| 9245816 | Semiconductor package and method of manufacturing the semiconductor package | Young Lyong Kim, Ae-Nee Jang | 2016-01-26 |