Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379043 | TSV structure having insulating layers with embedded voids | Ming-Yi Wang, Yen-Chu Chen | 2016-06-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379043 | TSV structure having insulating layers with embedded voids | Ming-Yi Wang, Yen-Chu Chen | 2016-06-28 |