Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9519024 | Apparatus for testing package-on-package semiconductor device and method for testing the same | — | 2016-12-13 |
| 9491894 | Manufacturing method of cover structure | — | 2016-11-08 |
| 9470749 | Test apparatus with dry environment | Xin Wu, Hsuan-Jen Shen, Chin-Yi Ou Yang | 2016-10-18 |
| 9458540 | Package substrate and manufacturing method thereof | Chin-Sheng Wang | 2016-10-04 |
| 9449570 | Driving circuit | Chih-Chuan Huang | 2016-09-20 |
| 9418931 | Package structure and manufacturing method thereof | — | 2016-08-16 |
| 9347989 | Test device for testing a PoP stacked-chip | Meng-Kung Lu | 2016-05-24 |
| 9250292 | Testing system for testing semiconductor package stacking chips and semiconductor automatic tester thereof | — | 2016-02-02 |