Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9231124 | Ball grid array packaged camera device soldered to a substrate | Yew Kwang Low, Sim Ying Yong | 2016-01-05 |
BP
Binghua Pan
Overall (2016): #454,629 of 481,213Top 95%
1
Patents 2016