Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524926 | Packaged device with additive substrate surface modification | Benjamin Stassen Cook, Juan Alejandro Herbsommer, Yong Lin, Rongwei Zhang, Matthew David Romig | 2016-12-20 |
| 9378984 | Packaging a semiconductor device having wires with polymerized insulator skin | Rongwei Zhang | 2016-06-28 |
| 9305869 | Packaged semiconductor device having leadframe features as pressure valves against delamination | Rongwei Zhang | 2016-04-05 |