Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397016 | Flip chip assembly process for ultra thin substrate and package on package assembly | A. Vethanayagam Rudge, Bok Sim Lim, Mun Leong Loke, Kang Eu Ong, Sih Fei Lim +1 more | 2016-07-19 |