Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9414484 | Thermal expansion compensators for controlling microelectronic package warpage | Richard J. Harries | 2016-08-09 |
| 9362253 | Bumpless build-up layer package with pre-stacked microelectronic devices | — | 2016-06-07 |