Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508610 | Inline measurement of molding material thickness using terahertz reflectance | Shuhong Liu, Zhiyong Wang, Deepak Goyal, Shripad Gokhale, Jieping Zhang | 2016-11-29 |
| 9441952 | Metrology tool for electroless copper thickness measurement for BBUL process development monitoring | Zhiyong Wang, Yu-Chun Chen, Shuhong Liu | 2016-09-13 |
| 9389064 | Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens | Shuhong Liu, Zhiyong Wang, Deepak Goyal | 2016-07-12 |