Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257368 | Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias | Eng Huat Goh | 2016-02-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257368 | Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias | Eng Huat Goh | 2016-02-09 |