Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397151 | Packaged integrated circuits having high-Q inductors therein and methods of forming same | Kenneth L. Astrof, Robert A. Gubser, Ajay Kumar Ghai, Viresh Piyush Patel | 2016-07-19 |
| 9332629 | Flip chip bump array with superior signal performance | — | 2016-05-03 |