Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9388037 | Device using glass substrate anodic bonding | Jeffery F. Summers | 2016-07-12 |
| 9330874 | Solder bump sealing method and device | Vikram Patil | 2016-05-03 |
| 9315375 | Method using glass substrate anodic bonding | Jeffery F. Summers | 2016-04-19 |
| 9274180 | Microfabricated magnetic field transducer with flux guide | — | 2016-03-01 |