Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508625 | Semiconductor die package with multiple mounting configurations | Theng Chao Long | 2016-11-29 |
| 9490199 | Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangements | Theng Chao Long, Wan Yee Ng, Kong Sin Chong | 2016-11-08 |
| 9484280 | Semiconductor device and method of manufacturing a semiconductor device | Tiam Meng Pon, Theng Chao Long | 2016-11-01 |
| 9252063 | Extended contact area for leadframe strip testing | Nee Wan Khoo, Lay Yeap Lim | 2016-02-02 |