Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9475691 | Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device | Kok Yau Chua, Sook Woon Chan, Chau Fatt Chiang, Matthias Steiert, Kian Hong Yeo +3 more | 2016-10-25 |
| 9312226 | Semiconductor device having an identification mark | Berthold Schuderer, Mathias Vaupel, Raimund Peichl | 2016-04-12 |