Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461004 | Semiconductor workpiece having a semiconductor substrate with at least two chip areas | Andreas Meiser, Markus Zundel, Martin Poelzl, Georg Ehrentraut | 2016-10-04 |
| 9397055 | Processing of thick metal pads | Rudolf Zelsacher | 2016-07-19 |