Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9349804 | Composite wafer for bonding and encapsulating an SiC-based functional layer | Rudolf Berger, Hans-Joachim Schulze, Anton Mauder, Wolfgang Lehnert, Roland Rupp | 2016-05-24 |