Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484315 | Chip structure having bonding wire | Po-Chen Lin, Jing-Yao Chang | 2016-11-01 |
| 9391049 | Molding package assembly and molding material | Chau-Jie Zhan | 2016-07-12 |
| 9237631 | Light emitting chip and light emitting device having the same | Yu-Sheng Chen, Cheng-Chun Liao, Chia-Yen Lee | 2016-01-12 |