Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397010 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | David S. Collins, Steven H. Voldman | 2016-07-19 |
| 9275997 | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry | David S. Collins, Steven H. Voldman | 2016-03-01 |