PI

Phillip Duane Isaacs

Globalfoundries: 1 patents #828 of 2,145Top 40%
IBM: 1 patents #5,048 of 10,295Top 50%
📍 Rochester, MN: #128 of 448 inventorsTop 30%
🗺 Minnesota: #1,262 of 6,786 inventorsTop 20%
Overall (2016): #108,119 of 481,213Top 25%
2
Patents 2016

Issued Patents 2016

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9462703 Solder void reduction between electronic packages and printed circuit boards — 2016-10-04
9426900 Solder void reduction for component attachment to printed circuit boards — 2016-08-23