Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496188 | Soldering three dimensional integrated circuits | Martin Eckert, Eckhard Kunigkeit, Quintino L. Trianni | 2016-11-15 |
| 9401222 | Determining categories for memory fail conditions | Martin Eckert, Nils Schlemminger | 2016-07-26 |
| 9322848 | Ball grid array configuration for reliable testing | Dieter Wendel | 2016-04-26 |
| 9250289 | System for electrical testing and manufacturing of a 3-D chip stack and method | Martin Eckert, Eckhard Kunigkeit, Quintino L. Trianni | 2016-02-02 |