Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373559 | Low-stress dual underfill packaging | Peter J. Brofman, Marie-Claude Paquet | 2016-06-21 |
| 9287230 | Thermocompression for semiconductor chip assembly | — | 2016-03-15 |
JS
Julien Sylvestre
Overall (2016): #127,214 of 481,213Top 30%
2
Patents 2016