Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9420708 | Method for manufacturing multilayer printed wiring board | Toshiaki Hibino | 2016-08-16 |
| 9401320 | Combined substrate | Tomoya DAIZO, Takeshi Furusawa, Wataru Nakamura, Yuki Ito, Yuki Yoshikawa +1 more | 2016-07-26 |