Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484311 | Chip package and packaging method | Xuequan Yu, Ping Yu | 2016-11-01 |
YB
Yadong Bai
Overall (2016): #180,660 of 481,213Top 40%
1
Patents 2016