Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9240362 | Layer arrangement and a wafer level package comprising the layer arrangement | Vivek Chidambaram, Ranganathan Nagarajan, Bangtao Chen, Beng Yeung Ho | 2016-01-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9240362 | Layer arrangement and a wafer level package comprising the layer arrangement | Vivek Chidambaram, Ranganathan Nagarajan, Bangtao Chen, Beng Yeung Ho | 2016-01-19 |