Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431314 | Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device | Tetsuya Enomoto, Emi MIYAZAWA, Kazutaka Honda, Akira Nagai | 2016-08-30 |