Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449909 | Method of forming a package substrate | Li-Hua Lin, Yu-Yu Lin | 2016-09-20 |
CL
Chin-Sung Lin
Global Unichip: 1 patents #16 of 54Top 30%
Overall (2016): #439,225 of 481,213Top 95%
1
Patents 2016