Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9417415 | Interposer with polymer-filled or polymer-lined optical through-vias in thin glass substrate | Rao R. Tummala, Chia-Te Chou | 2016-08-16 |
| 9275934 | Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same | Fuhan Liu, Rao R. Tummala, Vijay Sukumaran, Vivek Swaminathan Sridharan, Qiao Chen | 2016-03-01 |