Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9328266 | Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC | Sampath K. Vanimisetti, Chen-Shih Wang | 2016-05-03 |
VB
Vidyashankar Ramasastry Buravalla
Overall (2016): #192,376 of 481,213Top 40%
1
Patents 2016