Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496248 | Interposer for integrated circuit chip package | Michael G. Lee | 2016-11-15 |
| 9346058 | Unit for grinding sample, unit for grinding and collecting sample, and process for grinding same | Kiyonori Higa, Shunji Hattori | 2016-05-24 |