Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9463973 | Reducing MEMS stiction by introduction of a carbon barrier | Robert F. Steimle | 2016-10-11 |
| 9458008 | Method of making a MEMS die having a MEMS device on a suspended structure | Chad S. Dawson, Fengyuan Li, Colin Bryant Stevens | 2016-10-04 |
| 9458010 | Systems and methods for anchoring components in MEMS semiconductor devices | Robert F. Steimle | 2016-10-04 |
| 9434602 | Reducing MEMS stiction by deposition of nanoclusters | Robert F. Steimle | 2016-09-06 |
| 9425115 | Glass frit wafer bond protective structure | Robert F. Steimle | 2016-08-23 |
| 9318376 | Through substrate via with diffused conductive component | Paige M. Holm, Lianjun Liu | 2016-04-19 |
| 9290380 | Reducing MEMS stiction by deposition of nanoclusters | Robert F. Steimle | 2016-03-22 |