Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418929 | Integrated circuit with sewn interconnects | Weng Hoong Chan | 2016-08-16 |
| 9351407 | Method for forming multilayer device having solder filled via connection | — | 2016-05-24 |
| 9299675 | Embedded die ball grid array package | Navas Khan Oratti Kalandar, Kesvakumar V. C. Muniandy | 2016-03-29 |