Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9469757 | Low dissipation factor resin composition and product made thereby | Rongtao WANG, Chen-Yu Hsieh, Wenjun Tian, Yu Gao, Ningning Jia +1 more | 2016-10-18 |
| 9402310 | Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same | Rongtao WANG, Chen-Yu Hsieh, Wenjun Tian, Ziqian Ma | 2016-07-26 |