Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9482720 | Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels | Sergej Deutsch | 2016-11-01 |
| 9367268 | Print production scheduling | Jun Zeng, Qing Duan, I-Jong Lin, Gary J. Dispoto | 2016-06-14 |