Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9330976 | Wafer processing method | Susumu Yakoo, Hiroyuki Takahashi, Kenji Okazaki, Yoshiteru Nishida | 2016-05-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9330976 | Wafer processing method | Susumu Yakoo, Hiroyuki Takahashi, Kenji Okazaki, Yoshiteru Nishida | 2016-05-03 |