KP

Karl Heinz Priewasser

DI Disco: 3 patents #4 of 90Top 5%
Overall (2016): #66,478 of 481,213Top 15%
3
Patents 2016

Issued Patents 2016

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9472442 Wafer processing method — 2016-10-18
9437439 Processing method for wafer having chamfered portion along the outer circumference thereof followed by thinning and separating — 2016-09-06
9397000 Wafer processing method — 2016-07-19