Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524931 | Wiring substrate, semiconductor package, and method for manufacturing semiconductor package | — | 2016-12-20 |
| 9240445 | Lateral semiconductor device | Takashi Suzuki, Norihito Tokura, Shigeki Takahashi, Youichi Ashida, Akira Yamada | 2016-01-19 |