Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431327 | Semiconductor device | Hsin-Chang Tsai, Chia-Yen Lee | 2016-08-30 |
| 9385070 | Semiconductor component having a lateral semiconductor device and a vertical semiconductor device | Hsin-Chang Tsai, Chia-Yen Lee | 2016-07-05 |
| 9275982 | Method of forming interconnection structure of package structure | Chia-Yen Lee, Hsin-Chang Tsai | 2016-03-01 |