Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318421 | Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof | Martin Becker, Frank Osterwald, Jacek Rudzki | 2016-04-19 |
| 9287232 | Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner | Mathias Kock | 2016-03-15 |